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Bonding Scholarship

Duration -- Not Specified --

Eligibility Requirements

Malaysian citizen
Below 25 years old on date of application
Strong leadership skills & active participation in extra curriculum, social and volunteer activities
Full-time student
Non-employed candidate
Must not be sponsored by other financial institutions
The candidate is required to serve an employment bond of 5 + 2 years with DRB-HICOM Group of Companies

Minimum Requirements
SPM/SPMV candidates with minimum 5 As inclusive of Mathematics and English


"Value of Awards

The scholarship covers tuition fee, library fee, lab fee, workshop fee, student activities fee, insurance fee, exam fee and hostel accommodation"

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